Market by Raw Material (Epoxy Resin, Glass Fabric, Phenolic Resin, Kraft Paper, Other Raw Materials) Substrate (Standard Multilayer, Flexible Circuits, High-Density Interconnect (HDI), Integrated Circuit (IC), Rigid 1-2 Sided, Rigid Flex) Application (Communications, Consumer Electronics, Industrial Electronics, Automotive, Military, Other Applications) Country Outlook | Forecast 2024-2032
As per Triton’s research report, the printed circuit board market in the Asia-Pacific is estimated to expand in terms of revenue at a CAGR of 5.64% during the forecast period 2024-2032.
Report scope can be customized per your requirements - Request Free Sample Report
The printed circuit board market in the Asia-Pacific region is experiencing significant growth, fueled by the rising adoption of smart devices, increasing demand for consumer electronics, and the expanding semiconductor market. Recently held ‘Electronics Circuit Asia 2024’ in Thailand had the industry experts discuss the current trends for high-layer count PCBs and HDI to meet next-generation requirements of EV batteries, automotive, and more. The event also highlighted the growth prospects of PCB production, particularly in Southeast Asia. Thailand is rapidly emerging as a new hotspot, drawing significant investments from Korean, Taiwanese, Chinese, and Japanese PCB companies. Evidently, the demand for printed circuit boards in the Asia-Pacific region is bound to expand in the coming years.
The countries analyzed in this region include:
China leads with a major market share, recording nearly $34.28 billion in 2023.
The printed circuit board market in China is rapidly growing, driven by the expanding consumer electronics sector and the increased manufacturing capacity of production companies.
Diehl Controls is also set to launch production of electronic systems at its second plant in China. This investment aims to boost sales to over 2 billion RMB by 2026. As production increases to meet higher sales targets, the demand for PCBs will rise, creating a ripple effect that boosts overall PCB demand in the country.
Additionally, the PCB manufacturers in China are driving a surge in investments across Southeast Asia, with a significant focus on Thailand. Such initiatives are widening the scope of the printed circuit board market in the country.
Printed Circuit Board Market Forecast for India
Recently, Amber Enterprises revealed its plan to invest ₹2,000 crore to establish a printed circuit board manufacturing facility in India. The new PCB production facility will cater to a wide range of industries, including mobile, IT, semiconductors, aerospace, and more. This initiative aims to meet both domestic and export demand, supporting India’s push to enhance electronics manufacturing and reduce reliance on imports for key components.
Similarly, in June 2024, BPL launched another PCB production unit in Bengaluru with a ₹20 crore investment, expected to significantly impact India’s PCB industry. The facility supports commercial production, including double-side and multi-layer PCBs, and has created 110 direct and 150 indirect jobs. Such active efforts to cater to the increasing manufacturing of electronic devices are set to widen the scope of the printed circuit board market in the country.
The printed circuit board market is segmented by raw material, substrate, and application. Based on raw material, it is further classified into glass fabric, epoxy resin, Kraft paper, phenolic resin, and other raw materials. Glass fabric is used in printed circuit boards to offer protection against moisture, electrostatic discharge, power failures, and high temperatures. An advanced technique for reinforcing glass fiber during lamination results in a flatter, thinner weave. This creates a smoother, more uniform surface, ideal for laser drilling and mechanical processes while also enhancing dimensional stability.
Contender Analysis in the Printed Circuit Board Market:
Unimicron Technology Corporation manufactures and sells printed circuit board and IC carrier products in Taiwan and the international market. The company provides rigid PCBs, which include heavy-density interconnection boards, heavy copper, multi-layer PCBs, and back panel high-layer count PCBs. It also offers a connector, flexible printed circuit, package-on-package substrate UTS and substrate. Its products are used in tablets, MP3 players, portable game consoles, GPS, e-readers, camcorders, DSC and LCD modules. It is headquartered in Taoyuan, Taiwan.
Bloom Energy, a California-based company, signed an agreement with Unimicron to install up to 10 MW of fuel cells at its plants in Taiwan. The installations are expected to be completed by 2026.
Other key contenders in the market include Ascent Circuit Pvt Ltd, Daeduck Electronics, TTM Technologies Inc, Hannstar Board Corporation, Zhen Ding Technology Holding Ltd, and Young Poong Electronics Co Ltd.
KEY DELIVERABLES OF THE REPORT:
Market CAGR during the forecasting years 2024-2032
Detailed data highlighting key insights, industry components, and market strategies
Comprehensive information and estimation of the printed circuit board market revenue growth in APAC and its influence on the parent market
In-depth study of forthcoming trends in consumer behavioral patterns
A meticulous analysis of the competitive landscape and Porter’s Five Forces
A wide-ranging study of factors that will challenge the APAC printed circuit board market’s growth during the upcoming years
1. ASIA-PACIFIC
PRINTED CIRCUIT BOARD MARKET - SUMMARY
2. INDUSTRY
OUTLOOK
2.1. IMPACT
ANALYSIS ON THE PRINTED CIRCUIT BOARD MARKET
2.1.1. COVID-19
IMPACT ON THE PRINTED CIRCUIT BOARD MARKET
2.2. PORTER’S
FIVE FORCES ANALYSIS
2.2.1. THREAT
OF NEW ENTRANTS
2.2.2. THREAT
OF SUBSTITUTES
2.2.3. BARGAINING
POWER OF BUYERS
2.2.4. BARGAINING
POWER OF SUPPLIERS
2.2.5. THREAT
OF COMPETITIVE RIVALRY
2.3. SUPPLY
CHAIN ANALYSIS
2.3.1. INDUSTRY
COMPONENTS
2.3.2. RESIN
& FIBER SUPPLIERS
2.3.3. LAMINATORS
& MANUFACTURERS
2.3.4. DISTRIBUTORS
AND RETAILERS
2.3.5. END-USERS
2.4. KEY
BUYING IMPACT ANALYSIS
2.4.1. APPLICATION
2.4.2. RELIABILITY
2.4.3. COST
2.5. KEY
MARKET STRATEGIES
2.5.1. PRODUCT
LAUNCHES
2.5.2. ACQUISITIONS
2.5.3. BUSINESS
DIVESTITURES & EXPANSIONS
2.6. MARKET
DRIVERS
2.6.1. INCREASING
DEMAND FOR SMART ELECTRONICS
2.6.2. EXPANDING
APPLICATIONS OF SEMICONDUCTORS
2.6.3. GROWING
UTILIZATION OF ELECTRONICS ACROSS VARIOUS SECTORS
2.6.4. SURGE
IN INTERNET USAGE
2.7. MARKET
CHALLENGES
2.7.1. COMPETITIVE
PRESSURES RESULTING IN PRICE DECLINES
2.7.2. FLUCTUATIONS
IN RAW MATERIAL COSTS
2.7.3. REGULATORY
FRAMEWORKS ADDRESSING E-WASTE MANAGEMENT
2.8. MARKET
OPPORTUNITIES
2.8.1. GROWTH
OPPORTUNITIES PRESENTED BY IOT-ENABLED INTERCONNECTED DEVICES
2.8.2. ESCALATING
DEMAND IN EMERGING MARKETS
2.9. ANALYST
PERSPECTIVE
3. ASIA-PACIFIC
PRINTED CIRCUIT BOARD MARKET – BY RAW MATERIAL
3.1. EPOXY
RESIN
3.2. GLASS
FABRIC
3.3. PHENOLIC
RESIN
3.4. KRAFT
PAPER
3.5. OTHER
RAW MATERIALS
4. ASIA-PACIFIC
PRINTED CIRCUIT BOARD MARKET – BY SUBSTRATE
4.1. STANDARD
MULTILAYER
4.2. FLEXIBLE
CIRCUITS
4.3. HIGH-DENSITY
INTERCONNECT (HDI)
4.4. INTEGRATED
CIRCUIT (IC)
4.5. RIGID
1-2 SIDED
4.6. RIGID
FLEX
5. ASIA-PACIFIC
PRINTED CIRCUIT BOARD MARKET – BY APPLICATION
5.1. COMMUNICATIONS
5.2. CONSUMER
ELECTRONICS
5.3. INDUSTRIAL
ELECTRONICS
5.4. AUTOMOTIVE
5.5. MILITARY
5.6. OTHER
APPLICATIONS
6. ASIA-PACIFIC
PRINTED CIRCUIT BOARD MARKET – BY COUNTRY OUTLOOK
6.1. ASIA-PACIFIC
6.1.1. COUNTRY
ANALYSIS
6.1.1.1. CHINA
6.1.1.1.1. CHINA
PRINTED CIRCUIT BOARD MARKET FORECAST & PROSPECTS
6.1.1.2. JAPAN
6.1.1.2.1. JAPAN
PRINTED CIRCUIT BOARD MARKET FORECAST & PROSPECTS
6.1.1.3. INDIA
6.1.1.3.1. INDIA
PRINTED CIRCUIT BOARD MARKET FORECAST & PROSPECTS
6.1.1.4. SOUTH
KOREA
6.1.1.4.1. SOUTH
KOREA PRINTED CIRCUIT BOARD MARKET FORECAST & PROSPECTS
6.1.1.5. ASEAN
COUNTRIES
6.1.1.5.1. ASEAN
COUNTRIES PRINTED CIRCUIT BOARD MARKET FORECAST & PROSPECTS
6.1.1.6. AUSTRALIA
& NEW ZEALAND
6.1.1.6.1. AUSTRALIA
& NEW ZEALAND PRINTED CIRCUIT BOARD MARKET FORECAST & PROSPECTS
6.1.1.7. REST
OF ASIA-PACIFIC
6.1.1.7.1. REST
OF ASIA-PACIFIC PRINTED CIRCUIT BOARD MARKET FORECAST & PROSPECTS
7. COMPETITIVE
LANDSCAPE
7.1. AT&S
(AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT)
7.1.1. OVERVIEW
7.1.2. PORTFOLIO
7.1.3. KEY
STRENGTHS
7.1.4. KEY
CHALLENGES
7.2. ASCENT
CIRCUIT PVT LTD
7.2.1. OVERVIEW
7.2.2. PORTFOLIO
7.2.3. KEY
STRENGTHS
7.2.4. KEY
CHALLENGES
7.3. DAEDUCK
ELECTRONICS
7.3.1. OVERVIEW
7.3.2. PORTFOLIO
7.3.3. KEY
STRENGTHS
7.3.4. KEY
CHALLENGES
7.4. COMPEQ
MANUFACTURING CO LTD
7.4.1. OVERVIEW
7.4.2. PORTFOLIO
7.4.3. KEY
STRENGTHS
7.4.4. KEY
CHALLENGES
7.5. EPITOME
COMPONENTS LTD
7.5.1. OVERVIEW
7.5.2. PORTFOLIO
7.5.3. KEY
STRENGTHS
7.5.4. KEY
CHALLENGES
7.6. IBIDEN
INC
7.6.1. OVERVIEW
7.6.2. PORTFOLIO
7.6.3. KEY
STRENGTHS
7.6.4. KEY
CHALLENGES
7.7. HANNSTAR
BOARD CORPORATION
7.7.1. OVERVIEW
7.7.2. PORTFOLIO
7.7.3. KEY
STRENGTHS
7.7.4. KEY
CHALLENGES
7.8. ISU
PETASYS
7.8.1. OVERVIEW
7.8.2. PORTFOLIO
7.8.3. KEY
STRENGTHS
7.8.4. KEY
CHALLENGES
7.9. NIPPON
MEKTRON LTD
7.9.1. OVERVIEW
7.9.2. PORTFOLIO
7.9.3. KEY
STRENGTHS
7.9.4. KEY CHALLENGES
7.10. NAN YA
PCB CORPORATION
7.10.1. OVERVIEW
7.10.2. PORTFOLIO
7.10.3. KEY
STRENGTHS
7.10.4. KEY
CHALLENGES
7.11. OKI
PRINTED CIRCUITS CO LTD
7.11.1. OVERVIEW
7.11.2. PORTFOLIO
7.11.3. KEY
STRENGTHS
7.11.4. KEY
CHALLENGES
7.12. SAMSUNG
ELECTRONICS CO LTD
7.12.1. OVERVIEW
7.12.2. PORTFOLIO
7.12.3. KEY
STRENGTHS
7.12.4. KEY
CHALLENGES
7.13. SHENNAN
CIRCUITS CO LTD
7.13.1. OVERVIEW
7.13.2. PORTFOLIO
7.13.3. KEY
STRENGTHS
7.13.4. KEY
CHALLENGES
7.14. TRIPOD
TECHNOLOGY CORPORATION
7.14.1. OVERVIEW
7.14.2. PORTFOLIO
7.14.3. KEY
STRENGTHS
7.14.4. KEY
CHALLENGES
7.15. UNIMICRON
TECHNOLOGY CORPORATION
7.15.1. OVERVIEW
7.15.2. PORTFOLIO
7.15.3. KEY
STRENGTHS
7.15.4. KEY
CHALLENGES
7.16. TTM TECHNOLOGIES
INC
7.16.1. OVERVIEW
7.16.2. PORTFOLIO
7.16.3. KEY
STRENGTHS
7.16.4. KEY
CHALLENGES
7.17. ZHEN
DING TECHNOLOGY HOLDING LTD
7.17.1. OVERVIEW
7.17.2. PORTFOLIO
7.17.3. KEY
STRENGTHS
7.17.4. KEY
CHALLENGES
7.18. YOUNG
POONG ELECTRONICS CO LTD
7.18.1. OVERVIEW
7.18.2. PORTFOLIO
7.18.3. KEY
STRENGTHS
7.18.4. KEY
CHALLENGES
8. RESEARCH
METHODOLOGY & SCOPE
8.1. RESEARCH
SCOPE & DELIVERABLES
8.2. SOURCES
OF DATA
8.3. RESEARCH
METHODOLOGY
TABLE 1: ASIA-PACIFIC PRINTED
CIRCUIT BOARD MARKET, BY COUNTRY OUTLOOK, 2024-2032 (IN $ BILLION)
TABLE 2: LIST OF PRODUCT
LAUNCHES
TABLE 3: LIST OF ACQUISITIONS
TABLE 4: LIST OF BUSINESS
DIVESTITURES & EXPANSIONS
TABLE 5: ASIA-PACIFIC PRINTED
CIRCUIT BOARD MARKET, BY RAW MATERIAL, 2024-2032 (IN $ BILLION)
TABLE 6: ASIA-PACIFIC PRINTED
CIRCUIT BOARD MARKET, BY SUBSTRATE, 2024-2032 (IN $ BILLION)
TABLE 7: ASIA-PACIFIC PRINTED
CIRCUIT BOARD MARKET, BY APPLICATION, 2024-2032 (IN $ BILLION)
TABLE 8: ASIA-PACIFIC
PRINTED CIRCUIT BOARD MARKET, BY COUNTRY OUTLOOK, 2024-2032 (IN $ BILLION)
FIGURE 1: PORTER’S FIVE FORCES
ANALYSIS
FIGURE 2: SUPPLY CHAIN
ANALYSIS
FIGURE 3: KEY BUYING IMPACT
ANALYSIS
FIGURE 4: ASIA-PACIFIC PRINTED
CIRCUIT BOARD MARKET, BY RAW MATERIAL, 2023 & 2032 (IN %)
FIGURE 5: ASIA-PACIFIC PRINTED
CIRCUIT BOARD MARKET, BY EPOXY RESIN, 2024-2032 (IN $ BILLION)
FIGURE 6: ASIA-PACIFIC PRINTED
CIRCUIT BOARD MARKET, BY GLASS FABRIC, 2024-2032 (IN $ BILLION)
FIGURE 7: ASIA-PACIFIC PRINTED
CIRCUIT BOARD MARKET, BY PHENOLIC RESIN, 2024-2032 (IN $ BILLION)
FIGURE 8: ASIA-PACIFIC PRINTED
CIRCUIT BOARD MARKET, BY KRAFT PAPER, 2024-2032 (IN $ BILLION)
FIGURE 9: ASIA-PACIFIC PRINTED
CIRCUIT BOARD MARKET, BY OTHER RAW MATERIALS, 2024-2032 (IN $ BILLION)
FIGURE 10: ASIA-PACIFIC
PRINTED CIRCUIT BOARD MARKET, BY SUBSTRATE, 2023 & 2032 (IN %)
FIGURE 11: ASIA-PACIFIC
PRINTED CIRCUIT BOARD MARKET, BY STANDARD MULTILAYER, 2024-2032 (IN $ BILLION)
FIGURE 12: ASIA-PACIFIC
PRINTED CIRCUIT BOARD MARKET, BY FLEXIBLE CIRCUITS, 2024-2032 (IN $ BILLION)
FIGURE 13: ASIA-PACIFIC
PRINTED CIRCUIT BOARD MARKET, BY HIGH-DENSITY INTERCONNECT (HDI), 2024-2032 (IN
BILLION)
FIGURE 14: ASIA-PACIFIC
PRINTED CIRCUIT BOARD MARKET, BY INTEGRATED CIRCUIT (IC), 2024-2032 (IN $ BILLION)
FIGURE 15: ASIA-PACIFIC
PRINTED CIRCUIT BOARD MARKET, BY RIGID 1-2 SIDED, 2024-2032 (IN $ BILLION)
FIGURE 16: ASIA-PACIFIC
PRINTED CIRCUIT BOARD MARKET, BY RIGID FLEX, 2024-2032 (IN $ BILLION)
FIGURE 17: ASIA-PACIFIC
PRINTED CIRCUIT BOARD MARKET, BY APPLICATION, 2023 & 2032 (IN %)
FIGURE 18: ASIA-PACIFIC
PRINTED CIRCUIT BOARD MARKET, BY COMMUNICATIONS, 2024-2032 (IN $ BILLION)
FIGURE 19: ASIA-PACIFIC
PRINTED CIRCUIT BOARD MARKET, BY CONSUMER ELECTRONICS, 2024-2032 (IN $ BILLION)
FIGURE 20: ASIA-PACIFIC
PRINTED CIRCUIT BOARD MARKET, BY INDUSTRIAL ELECTRONICS, 2024-2032 (IN $ BILLION)
FIGURE 21: ASIA-PACIFIC
PRINTED CIRCUIT BOARD MARKET, BY INTEGRATED CIRCUIT (IC), 2024-2032 (IN $ BILLION)
FIGURE 22: ASIA-PACIFIC
PRINTED CIRCUIT BOARD MARKET, BY AUTOMOTIVE, 2024-2032 (IN $ BILLION)
FIGURE 23: ASIA-PACIFIC
PRINTED CIRCUIT BOARD MARKET, BY MILITARY, 2024-2032 (IN $ BILLION)
FIGURE 24: ASIA-PACIFIC
PRINTED CIRCUIT BOARD MARKET, BY OTHER APPLICATIONS, 2024-2032 (IN $ BILLION)
FIGURE 25: ASIA-PACIFIC
PRINTED CIRCUIT BOARD MARKET, BY COUNTRY OUTLOOK, 2023 & 2032 (IN %)
FIGURE 26: CHINA PRINTED
CIRCUIT BOARD MARKET 2024-2032 (IN $ BILLION)
FIGURE 27: JAPAN PRINTED
CIRCUIT BOARD MARKET 2024-2032 (IN $ BILLION)
FIGURE 28: INDIA PRINTED
CIRCUIT BOARD MARKET 2024-2032 (IN $ BILLION)
FIGURE 29: SOUTH KOREA PRINTED
CIRCUIT BOARD MARKET 2024-2032 (IN $ BILLION)
FIGURE 30: ASEAN COUNTRIES
PRINTED CIRCUIT BOARD MARKET 2024-2032 (IN $ BILLION)
FIGURE 31: AUSTRALIA & NEW
ZEALAND PRINTED CIRCUIT BOARD MARKET 2024-2032 (IN $ BILLION)
FIGURE 32: REST OF
ASIA-PACIFIC PRINTED CIRCUIT BOARD MARKET 2024-2032 (IN $ BILLION)